R&D:
Carbon Nanotube Transistors and Interconnects


Manufacturing and Interconnection of Carbon Nanotube Transistors , Phase I
National Science Foundation, SBIR Phase I Project, Start Date: January 1, 2000

The objective of this Small Business Technology Transfer Phase I Project was to develop a novel integrated process for manufacturing and interconnecting a 3-D array of transistors made of carbon nanotubes, suitable for large-scale manufacturing. This large-scale, low-cost approach will potentially provide extremely fast, low-power, ultra-high-density logic and memory devices, which operate at room temperature. The fundamental enabling innovation of the process involves introducing controlled discontinuities in the structure of the carbon nanotube. We estimate that our fabrication technology will enable device densities of 1012 per cm2, limited only by lateral interconnect technology. A novel interconnect technology was also be investigated to provide device densities to 1014 per cm2.

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